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Image analysis of soldered joints subjected to mechanical stress
Publication at First Faculty of Medicine
|
2008
3 people
Abstract
Image analysis of soldered joints subjected to mechanical stress
Keywords
intermetallic compounds
leadfree soldering
mechanical stress
People
person
doc. Ing. Karel Dušek Ph.D.
First Faculty of Medicine
person
Marek Tučan
Person without faculty affiliation
person
Jan Urbánek
Person without faculty affiliation