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Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance
Publication at First Faculty of Medicine
|
2008
2 people
Abstract
Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance
Keywords
mechanical stress
temperature aging
solder joints
People
person
doc. Ing. Karel Dušek Ph.D.
First Faculty of Medicine
person
Marek Tučan
Person without faculty affiliation