The Removal of Ceramic Locks in Orthodontia by Means of Laser - Evaluation of the Effect of Diode Lasers Tm:YAP, Nd:YAG and GaAs
Abstract
The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated.
The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped, and GaAs diode generating 1.9 µm, 1.44 µm, and 0.808 µm, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding.
The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laser having output power 1W can be a good candidate for the ceramic bracket debonding procedure.