Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate

Abstract

Three Sn-Cu based lead-free solders, in particular the near eutectic Sn-0,7 wt.%Cu, the Sn-1,4 wt.%Cu and the alloy with Ni addition Sn-0,6 wt.%Cu-0,0wt.%Ni were used in this investigation to study the growth kinetics of the intermetallic compounds formed at the interface of the liquid Sn-Cu based solder and the Cu substrate. Cu and Ni influence significantly and in a different way both the morphology and the kinetics of IMC growt.

Keywords

• Intermetallic
• compounds
• interface
• between
• solders
• substrate