The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate
2009
Abstract
The effect of Cu and Ni alloying elements on the morphology of the intermetallic compounds formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly.
Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution.