- New types of lead-free solders on the base of tin and their properties2009 | Faculty of Mathematics and Physics
- Technological properties of lead free soldersPublication without faculty affiliation
- Methodology of the Lead and Lead Free Solders Surface Tension Measurement2008 | First Faculty of Medicine
- Microstructure and Mechanical Properties of Lead-Free Solder Joints2015 | Faculty of Mathematics and Physics
- Influence of mechanical stress on properties of lead and lead free soldered joints (1)Publication without faculty affiliation
- Influence of Mechanical Stress on Properties of Lead and Lead Free Soldered Joints (2)Publication without faculty affiliation
- Influence of latent heat released from solder joints on the reflow temperature profile2016 | Faculty of Mathematics and Physics
- Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate2009 | Faculty of Mathematics and Physics
- Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys2016 | Faculty of Mathematics and Physics