- Technological properties of lead free soldersPublication without faculty affiliation
- Surface tension measurement of the solders by non-wetting specimen2008 | First Faculty of Medicine
- Influence of Different Surface Finishes of PCB on the Solder Spread2011 | Faculty of Mathematics and Physics
- Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate2009 | Faculty of Mathematics and Physics
- Comparison of shear strength of soldered SMD resistors for various solder alloys2015 | Faculty of Mathematics and Physics
- Methodology of the Lead and Lead Free Solders Surface Tension Measurement2008 | First Faculty of Medicine
- New types of lead-free solders on the base of tin and their properties2009 | Faculty of Mathematics and Physics
- Effect of reflow technology and surface finishes of PCB on solder spreading2013 | Faculty of Mathematics and Physics
- Reactive Diffusion upon Planar Dissolving Copper in Solder Melts2011 | Faculty of Mathematics and Physics
- Cracks in Soldered Joints Subjected to Mechanical Stress2008 | First Faculty of Medicine
- Study of Influence of Thermal Capacity and Flux Activity on the Solderability2014 | Faculty of Mathematics and Physics
- Image analysis of soldered joints subjected to mechanical stress2008 | First Faculty of Medicine
- Influence of latent heat released from solder joints on the reflow temperature profile2016 | Faculty of Mathematics and Physics
- Experimental Study of the Influence of the Temperature Profile on the BGA Soldering2016 | Faculty of Mathematics and Physics
- Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints2014 | Faculty of Mathematics and Physics
- Influence of Latent Heat on the Shape of Temperature Profile for Different Types of Solder Alloys2016 | Faculty of Mathematics and Physics
- Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders2012 | Faculty of Mathematics and Physics
- The Effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate2009 | Faculty of Mathematics and Physics
- Effect of Ni on the structure and properties of the intermetallic layer formed by the reaction of liquid SnCu0,7 solder with Cu substrate2007 | Faculty of Mathematics and Physics
- Does it solder or not?1995 | Publication without faculty affiliation
- Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects2017 | Faculty of Mathematics and Physics
- Nanothermometry-enabled intelligent laser tissue soldering2023 | Faculty of Medicine in Pilsen
- Microstructure and Mechanical Properties of Lead-Free Solder Joints2015 | Faculty of Mathematics and Physics
- Image Analysis of the soldered jointsPublication without faculty affiliation
- Image analysis of the mechanical stressed soldered jointsPublication without faculty affiliation
- Methodology objective evaluation of the quality of soldered jointsPublication without faculty affiliation
- Contribution to determination of solders surface tension valuesPublication without faculty affiliation
- Wetting force measurement of the different types of solders and testing materialsPublication without faculty affiliation
- Influence of inert atmosphere on the mechanical stressed soldered jointsPublication without faculty affiliation
- Influence of mechanical stress on properties of lead and lead free soldered joints (1)Publication without faculty affiliation